IEEE International Conference on Computational Photography 2019

The University of Tokyo, Japan
May15-17, 2019

The field of Computational Photography seeks to create new photographic functionalities and experiences that go beyond what is possible with traditional cameras and image processing tools. The IEEE International Conference on Computational Photography is organized with the vision of fostering the community of researchers, from many different disciplines, working on computational photography.

Submission timeline

Dec. 10, 2018
[Extended] Dec. 17, 2018
Paper submission deadline
Dec. 17, 2018 Supplemental material due
Feb. 11-15, 2019 Rebuttal period
Feb. 26, 2019 Paper decisions
Mar. 29, 2019 Camera ready versions

Posters/Demos timeline

Mar. 25, 2019 Posters/demos deadline
Mar. 29, 2019 Posters/demos decision

Submission

IEEE International Conference on Computational Photography (ICCP 2019) seeks high quality submissions in all areas related to computational photography. The field of computational photography seeks to create new photographic and imaging functionalities and experiences that go beyond what is possible with traditional cameras and image processing tools. The IEEE International Conference on Computational Photography is organized with the vision of fostering the community of researchers, from many different disciplines, working on computational photography. We welcome all submissions that introduce new ideas to the field including, but not limited to, those in the following areas:

  • Advanced Image Processing
  • Camera Arrays and Multiple Images
  • Coded Aperture Imaging
  • Coherent Light Imaging
  • Compressive Sensing
  • Computational Displays
  • Computational Illumination
  • Computational Imaging for Microscopy
  • Computational Optics (wavefront coding, compressive optical sensing, digital holography, …)
  • High-performance Imaging (high-speed, hyper-spectral, high-dynamic range, thermal, confocal, polarization,…)
  • Imaging and Illumination Hardware
  • Imaging for Health and Biology
  • Machine Learning Techniques for Camera Design
  • Machine Learning Techniques for Image Processing
  • Mobile Imaging
  • Novel Imaging and Illumination Techniques for User Interfaces
  • Organizing and Exploiting Photon / Video Collections
  • Scientific Imaging and Videography
  • Structu Light and Time-of-flight Imaging

How to Submit

Paper format
Download author's kit. Submissions should be full papers in the IEEE transaction format. The paper for submission must be uploaded as a single pdf file, with a maximum size of 20 MB allowed.
Paper length
A typical paper length in ICCP has been 6-8 pages. This is a rough guideline, and there is no arbitrary strict maximum length imposed. Reviewers will be instructed to weigh the contribution of a paper relative to its length.
Supplementary material
Supplementary material can also be submitted. It must be uploaded as a single zip file with size up to 100 MB total.
Policies
The reviewing process will be double blind. Submissions must present original unpublished work. Furthermore, work submitted to ICCP cannot be submitted to another forum (journal, conference or workshop) during the ICCP reviewing period (Dec. 2018 – Feb. 2019).


Team

General Chair
Yasuhiro Mukaigawa
NAIST
Program Chairs
Hajime Nagahara
Osaka University
 
Mohit Gupta
University of Wisconsin-Madison
 
Matthias Hullin
University of Bonn
Local Arrangement
Yoichi Sato
The University of Tokyo
Publication
Jean-François Lalonde
Université Laval
Transaction
Oliver Cossairt
Northwestern University
Poster/Demo
Yasuyuki Matsushita
Osaka University
 
Jingyi Yu
University of Delaware
Industry
Shinsaku Hiura
Hiroshima City University
 
Ashok Veeraraghavan
Rice University
Finance
Takuya Funatomi
NAIST
 
Aswin Sankaranarayanan
Carnegie Mellon University
Web/Social Media
Hiroyuki Kubo
NAIST

Program Committee

Achuta Kadambi
UCLA
Adams Andrew
Google
Adrian Jarabo
University of Zaragoza
Anat Levin
Technion
Ashok Veeraraghavan
Rice University
Aswin Sankaranarayanan
Carnegie Mellon University
Atul Ingle
U. Wisconsin-Madison
Ayan Chakrabarti
Washington University in St. Louis
Belen Masia
Unizar
Clem Karl
Boston University
David Lindell
Stanford University
Diego Gutierrez
University of Zaragoza
Donald Dansereau
University of Sydney
Felix Heide
Princeton University
Gordon Wetzstein
Stanford University
Guy Satat
MIT Media Lab
Ioannis Gkioulekas
Carnegie Mellon University
Itzik Malkiel
Tel Aviv University
Ivo Ihrke
Inria Bordeaux
Jian Wang
Carnegie Mellon University
Jiawen Chen
Google
Jinwei Gu
Nvidia
Jonthan Barron
Google Research
Jue Wang
Face++ (Megvii)
Kyros Kutulakos
University of Toronto
Laura Waller
UC Berkeley
M. Salman Asif
University of California, Riverside
Martin Fuchs
Hochschule der Medien
Matthew O'Toole
Carnegie Mellon University
Miki Rubinstein
Google Inc.
Mitra Kaushik
IIT Madras
Nicolas Bonneel
CNRS
Nima Khademi Kalantari
Texas A&M University
Oliver Cossairt
Northwestern University
Ozcan Aydogan
UCLA
Paolo Favaro
University of Bern
Qing Wang
Northwestern Polytechnical University
Rick Szeliski
FaceBook
Shaodi You
Data61-CSIRO
Sunkavalli Kalyan
Adobe Research
Tali Treibitz
University of Haifa
Jun Tanida
Osaka University
Vivek Goyal
Boston University
Wolfgang Heidrich
KAUST
Xiang Huang
Argonne National Laboratory
Xing Lin
UCLA
Yebin Liu
Tsinghua University
Yoichi Sato
University of Tokyo
Zhan Yu
Adobe

Sponsors

Bronze Sponsors
General Sponsor
Technical Co-sponsorship
Call for Sponsors
Platinum Gold Silver Bronze
Full Admissions (free registrations) 4 3 2 1
Demo table (if requested) 1 1 1 1
Logo on website and all printed materials
Special recognition during banquet and other ceremonies
Customized events * - - -
Costs (Incl. sales tax. US Dollar or Japanese Yen) 10,000USD
1,100,000JPY
7,500USD
825,000JPY
5,000USD
550,000JPY
2,500USD
275,000JPY
*Industry chairs will work with Platinum sponsors to customize the sponsor’s involvement; examples include sponsorship of best paper award, student grants, the banquet dinner.
Industry Chairs: Shinsaku Hiura, Ashok Veeraraghavan
Contact : iccp2019-support@is.naist.jp
Call for Sponsors(PDF)

Location

4-6-1 KOMABA MEGURO-KU, TOKYO 153-8505, JAPAN

From Narita International Airport (NRT)

90min

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From Tokyo International Airport (HND)

60min

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